Telephone
    GENE-APL6, Apollo Lake, 3.5” SubCompact Board with Intel® Pen GENE-APL6, Apollo Lake, 3.5” SubCompact Board with Intel® Pen GENE-APL6 GENE-APL6 GENE-APL6 GENE-APL6 GENE-APL6 GENE-APL6

    GENE-APL6

    3.5” 嵌入式主板,搭载Intel® Pentium® N4200/ Celeron® N3350 SoC处理器

    产品比较

    产品介绍

    配备了Intel®Pentium®N4200或Celeron®N3350处理器和DDR3L内存的无风扇GENE-APL6采用了焊接设计,可以轻松实现散热器,将CPU散热的热量通过机箱传导出去。 可根据要求提供其他宽温度支持控制。9V至36V的宽幅直流输入范围允许电路板克服电源波动并继续在工厂自动化和车载系统的不稳定环境中运行。 GENE-APL6进一步加强了抗振措施,包括板载eMMC存储容量高达128G。

    研扬是一家以客户为中心的公司,在设计GENE-APL6时,它响应了对双LVDS支持的要求。 具有高抗扰性的低功耗技术非常适合坚固的应用,并且HDMI端口可以作为定制选件安装。 四个USB端口,四个COM端口,以及Mini Card和mSATA扩展插槽,使电路板可以灵活地匹配其实力。

    通过消除弱点,例如仅通过扩展插槽进行存储,并添加最终用户想要查看的功能,我们已经使GENE-APL6成为市场上最强大,最完整的工厂自动化和车载主板。

    功能特点

    • DDR3L 1866, Single Channel SODIMM x 1, Non-ECC (Max.8GB, up to 1600MHz)
    • VGA/LVDS/LVDS2 (HDMI Co-layout with LVDS2 Optional)
    • 2 CH Audio, SATA 6.0 Gb/s x 1, eMMC up to 64G (Optional)
    • Supports 8-bit Digital I/O, USB 2.0 x 2, USB 3.2 Gen 1 x 2, COM x 4
    • Mini Card x 1 (Full-size), mSATA x 1 (Half-size)
    • 9~36V wide DC input or +12V only (Optional), AT/ATX Mode
    • Supports TPM (Optional)

    技术规格 [GENE-APL6]

    System
    Form Factor3.5" SubCompact Board
    CPUIntel® Atom®/Celeron®/Pentium® Processor:
    Pentium N4200 (4C/4T,1.10GHz,up to 2.50GHz, 6W)
    Celeron N3350 (2C/2T,1.10GHz,up to 2.40GHz, 6W)
    Atom E3950 (4C/4T,1.60GHz, up to 2.00GHz, 9.5W)
    Atom E3940 (4C/4T,1.60GHz,up to 1.80GHz, 9.5W)
    Atom E3930 (2C/2T,1.30GHz,up to 1.80GHz, 6.5W
    ChipsetIntegrated with Intel® SoC
    Memory TypeDDR3L 1866, Single Channel SODIMM x 1, Non-ECC (Max.8GB, up to 1600MHz)
    BIOSUEFI
    Wake on LANYes
    Watchdog Timer255 Levels
    SecurityTPM 2.0 (Optional)
    RTC BatteryLithium Battery 3V/240mAh
    Dimension5.75" x 4" (146mm x 101.7mm)
    OS supportWindows 10 (64bit)
    Linux Ubuntu 21.04.0/Kernel 5.10
    Power
    Power Requirement+9-36V (Optional: +12V)
    Power Supply TypeAT/ATX
    ConnectorPhoenix 2-pin Connector
    Power ConsumptionIntel® E3950, DDR3L 1866MHz 8G, 2.36A @+12V(TYPICAL)
    Intel® E3950, DDR3L 1866MHz 8G, 2.41A @+12V(MAX)
    Display
    ControllerIntel® HD Graphics 500/505
    LVDS/eDPLVDS1 Dual Channel 18/24bit x 1, up to 1920 x 1080
    LVDS2 Dual Channel 18/24bit x 1 (Optional: HDMI1.4b, up to 3840 x 2160)
    Display InterfaceVGA x 1, up to 1920 x 1200
    Multiple DisplayUp to 3 Simultaneous Displays
    audio
    CODECRealtek ALC897/892
    Audio InterfaceLine-in/Line-out/MIC
    Speaker
    external i/o
    EthernetIntel® i210/i211, 10/100/1000Base, RJ-45 x 2
    USBUSB3.2 Gen 1 x 2
    Serial PortCOM1 (RS232)
    VideoVGA x 1
    internal i/o
    USBUSB 2.0 x 2
    Serial PortCOM2, COM3 (RS232/422/485, support 5V/12V/RI)
    COM4 (RS232)
    VideoLVDS1 x 1
    LVDS2/HDMI x 1(Default:LVDS2)
    SATASATA III x 1
    +5V SATA Power Connector x 1
    AudioAudio Header x 1
    DIO/GPIO8-bit
    SMBus/I2CI2C/SMBus x 1 (Default: I2C)
    Touch4/5/8-wire Touch Controller x 1 (optional)
    FanDC Fan x 1 (optional: Smart Fan)
    SIMMicro SIM x 1 (Optional)
    Front PanelHDD LED, PWR LED, Power Button, Buzzer, Reset
    OtherseMMC 16G/32G/64G (optional)
    Parallel Port(SPP/EPP/ECP) x 1 (optional, select by BIOS)
    expansion
    Mini PCI-E/mSATAFull-size mPCIe x 1
    Half-size mSATA x 1
    M.2
    Others
    environment & certification
    Operating Temperature32°F ~ 140°F (0°C ~ 60°C), WiTAS2 -40°F ~ 185°F (-40°C ~ 85°C)
    Storage Temperature-40°F ~ 185°F (-40°C ~ 85°C)
    Operating Humidity0% ~ 90% relative humidity, non-condensing
    MTBF (hours)374,567
    EMCCE/FCC Class A

    订购信息 [GENE-APL6]

    Part NumberGENE-APL6-A11-F001GENE-APL6-A11-F002GENE-APL6-A11-F003GENE-APL6-A11-F004GENE-APL6W2-A11-F005
    cpu N3350 N3350 N4200 N4200 E3950
    display VGA, LVDS, LVDS2 VGA, LVDS, LVDS2 VGA, LVDS, LVDS2 VGA, LVDS, LVDS2 VGA, LVDS, HDMI
    lan GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2
    usb USB 3.2 Gen1 x 2
    USB 2.0 x 2
    USB 3.2 Gen1 x 2
    USB 2.0 x 2
    USB 3.2 Gen1 x 2
    USB 2.0 x 2
    USB 3.2 Gen1 x 2
    USB 2.0 x 2
    USB 3.2 Gen1 x 2
    USB 2.0 x 2
    rs-232 2 2 2 2 2
    rs-232/422/485 2 2 2 2 2
    storage SATA x 1 mSATA x 1 SATA x 1 32GB eMMC SATA x 1 mSATA x 1 SATA x 1 32GB eMMC SATA x 1 mSATA x 1
    expansion slot MiniCard x 1 (Full) MiniCard x 1 (Full) MiniCard x 1 (Full) MiniCard x 1 (Full) MiniCard x 1 (Full)
    tpm 2.0 2.0 2.0
    power 9~36V 9~36V 9~36V 9~36V 12V
    operating temp 0°C ~ 60°C 0°C ~ 60°C 0°C ~ 60°C 0°C ~ 60°C WiTAS2 (-40~85°C)
    others DIO x 8 Touch Controller, SIM, DIO x 8 DIO x 8 Touch Controller, SIM, DIO x 8 SIM, DIO x 8

    下载 [GENE-APL6]

    • Datasheet
    • BIOS
    • Driver
    • Manual

    包装内容

    • GENE-APL6 MB x 1
    • TH3APL6010 (Heat spreader for CPU N Series) x 1
    • M16APL6001 (Heat spreader for CPU E Series) x 1

    选购配件

    Part Number Description QTY per Board
    1700050207 USB Cable, 20cm 2
    1701090150 Com Cable, 15cm 3
    1709100254 Audio Jack Cable, 25cm 1
    1709070500 SATA Cable, 50cm 1
    1702150155 SATA Power Cable, 15cm 1
    170220020B ATX Power Cable, 20cm 1
    170204010R Power Cable, 10cm 1
    GENE-APL6-HSK01 HeatSink.146X80X14mm.GENE-APL6.(used with heat spreader) 1

    FAQ [GENE-APL6]

    What is approved vendor list of DDR module for GENE-APL6?

    1. Transcend.TS512MSK64W8H 4GB.DDR3L SODIMM 204Pin.1866Mhz (Samsung.K4B4G0846X)

    2. InnoDisk.M3S0-4GSSCLQE-26 4GB.DDR3L SODIMM.204Pin,1866Mhz (Samsung.K4B4G0846X)