概要

The NanoCOM-APL is built around a 6th Generation Intel® Atom™, Celeron®, or Pentium® processor and features onboard LPDDR4 memory with a capacity of up to 8GB. The 7W module’s low power-consumption architecture means it can be used at the heart of hand-held, battery-powered devices and fully enclosed IP67 applications.

Combined with an FPGA controller and an AI chip, the NanoCOM-APL is being used as the centerpiece of advanced machine vision systems that scan products to create 3D images that can be checked for faults. Because of its size and industrial operating temperature range, these systems can be used on a production line or even on a robotic arm.

The module also features 1GbE LAN connections, optional onboard eMMC storage of up to 64Gb, a PCIe x4 expansion slot, an LVDS, DDI, or eDP connections, and support for up to eight USB3.0 and two USB2.0 ports.

特徴

  • Intel® Atom™/Celeron®/Pentium® SoC
  • Onboard Memory LPDDR4 4GB/8GB
  • Intel I210/I211
  • Support eDP/LVDS, DDI D
  • SATA x2, eMMC 5.x (optional, up to 64GB)
  • USB 2.0 x8 + USB 3.0 x2
  • 2-wire UART, Tx/Rx x2
  • PCI-Express [x1] x4, 3 device available at any time.
  • DC Input Range, 12V
  • COM Express Mini Size, Pin-Out Type 10

仕様 [NANOCOM-APL]

system
Form FactorCOM Express, Mini size, Pin-out Type 10
CPUOnboard 6th Generation Intel® Atom™/Celeron®/Pentium® SoC
CPU FrequencyE39xx series, N4xxx series
ChipsetIntel® Atom™/Celeron® Processor SoC
Memory TypeOnboard LPDDR4
Max. Memory Capacity8GB LPDDR4 Onboard
BIOSSPI type
Wake on LANYes
Watchdog Timer255 Levels
Power RequirementStandard : +12V, AT/ATX (Optional: +5V, AT/ATX)
Power Supply TypeAT/ATX
Power Consumption (Typical)Up to E3950 TDP 12W CPU
Dimension (L x W)3.31” x 2.17” (84mm x 55mm)
Operating Temperature32 °F ~ 140 °F (0 °C ~ 60 °C)
-40 °F ~ 185 °F (-40 °C ~ 80 °C)
Storage Temperature-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity0% ~ 90% relative humidity, non-condensing
MTBF (hours)80,000
CertificationCE/FCC
display
Display ControllerIntel® HD Graphic
Video OutputLVDS LCD/eDP, DDI x 1
LVDS InterfaceSupports 18-bit and 24-bit Single channel
i/o
EthernetIntel® I210IT
AudioHigh Definition Audio Interface
USB SupportUSB 2.0 x 8, USB 3.0 x 2
Serial PortTX/RX x 2
HDD InterfaceSATA 3 x 2
Onboard StorageOptional onboard eMMC
Expansion SlotPCIe [x1] x 4 (up to 3 devices)
LPC
SMBus
I2C
GPIOGPIO 8-bit
TPM

ご注文情報 [NANOCOM-APL]

Part NumberNANOCOM-APL-A11-0001NANOCOM-APL-A11-0002NANOCOM-APL-A11-0003
com express type Type 10 (COM.0 Rev3.0) Type 10 (COM.0 Rev3.0) Type 10 (COM.0 Rev3.0)
cpu N4200 N3350 E3950
memory 4GB DDR4 4GB DDR4 8GB DDR4
display LVDS, DDIx1 LVDS, DDIx1 LVDS, DDIx1
lvds 18/24 bit 1-channel
(Optional : eDP)
18/24 bit 1-channel
(Optional : eDP)
18/24 bit 1-channel
(Optional : eDP)
storage SATA x2
32GB eMMC
SATA x2
32GB eMMC
SATA x2
64GB eMMC
lan GbE x 1 GbE x 1 GbE x 1
usb USB 3.0 x 2
USB 2.0 x 8
USB 3.0 x 2
USB 2.0 x 8
USB 3.0 x 2
USB 2.0 x 8
uart 2 (TX /RX) 2 (TX /RX) 2 (TX /RX)
expansion slot PCI-E[x1] x4 PCI-E[x1] x4 PCI-E[x1] x4
power 12V 12V 12V
temp 0°C~60°C 0°C~60°C 0°C~60°C
others I2C, SMBus,
8b-GPIO/(SDIO)
I2C, SMBus,
8b-GPIO/(SDIO)
I2C, SMBus,
8b-GPIO/(SDIO)

ダウンロード [NANOCOM-APL]

  • Datasheet
  • BIOS
  • ドライバ
  • マニュアル

包装内容

  • NanoCOM-APL

アクセサリー

NanoCOM-APL-E-HSP01 Heat Spreader 84 x 55 x 11 mm, Black, NanoCOM-APL For E39xx CPU only
NanoCOM-APL-N-HSP01 Heat Spreader 84 x 55 x 11 mm, Black, NanoCOM-APL For Nxxx CPU only
NanoCOM-FAN01 CPU Cooler, for NanoCOM, to be used with Heat Spreader
ECB-920A-A10-0001 COM Type 1/6/10, Carrier Board, ATX, GbE, 8USB, 2COM, 4SATA, PCIe, AT/ATX, Legacy Free, Rev. A1.0