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UP Xtreme i12 – High-Performance, AI-Ready Embedded Developer Board

Stronger – Power-Efficient Multicore Architecture

An innovative next generation board, the UP Xtreme i12 (UPX-ADL/UPX-RAP) hosts the 12 core, 16 thread hybrid architecture of 12th/13th Gen Intel® Core™ Processors (formerly Alder Lake-P/Raptor Lake-P). This configuration increases energy-efficiency while doubling its predecessor’s thread count. Further, the UP Xtreme i12’s wide 12~36V power input range facilitates extended use for industrial applications, such as smart manufacturing. Customers can therefore harness CPU performance up to 20% greater than Tiger Lake while retaining continuous, efficient operation in more challenging environments.

Faster - Onboard LPDDR5, 2.5GbE, and a 2.47 x Increase in Graphics Speed

Greater processing is enhanced by up to 32GB of onboard LPDDR5 system memory, doubling bandwidth and memory capacity without the need for SODIMM module installation. Combining this accelerated data processing with USB 4.0 and 2.5GbE ports ensures high-speed connectivity to peripheral cameras and sensors, making the UP Xtreme i12 the perfect board for smart retail. Additionally, the 2.47 x increase in graphics speed provided by Intel® Iris® Xe graphics, with four simultaneous 4K displays.

Smarter – AI, 5G, Wi-Fi 6, and PCIe 4.0

The UP Xtreme i12 offers unprecedented expandability. Supporting Wi-Fi 6 and 5G via M.2 2230 E and 3052 B-Keys, the UP Xtreme i12 also contains two M.2 2280 M-Keys for PCIe 4.0 storage and AI module support. Its AI performance is augmented by Intel® DL Boost and the Intel® distribution of OpenVINO™ toolkit, which yields up to 2.81 x the GPU image classification inferencing performance of the previous generation. Further, its Intel® i226IT ethernet package supports Time Sensitive Networking (TSN) to prioritize real-time workloads and execute tasks within precise time cycles. With such high-level performance, the UP Xtreme i12 presents an elite solution for IoT and robotics projects.

✦ Equipped with 12th Gen Intel® Core™ CPUs and Iris® Xe graphics, the UP Xtreme i12 supports multiple USB 3.2 Gen 2 & USB4 camera inputs and delivers real-time image processing. Dual M.2 2280 slots allow up to 52 TOPS from Hailo-8™ AI modules for powerful, efficient visual inspection. AI-Powered Quality Inspection with UP Xtreme i12 and Hailo for Smarter Manufacturing >

✦ EDM - UP Xtreme i12 sets a new standard for power, speed, and AI performance >

✦ If you are interested in a system-level product to start your AI project, please check out the UP Xtreme i12 Edge >

✦ 🔔 Free Edge AI Toolkit — streamline object detection, benchmarking, and AI model conversion to accelerate your AI projects on UP platforms. Try Edge AI Toolkit now >

Optional Accessories

Part NumberDescription
9741364A00Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna(Enli,QCNFA364A)
9651926001(TF).M.2 2230 WiFi Kit.802.11ac.2.4G/5G,W/BT Intel.9260.NGWG.NV,958867 w/2 cable & antenna
1702150155Power Cable.15P SATA(F).2P 2.0mm, Housing(PH).15cm
1700070200SATA CABLE.7P 180D(F) w/lock.to 7P 90D(F) w/o, lock SATA.20cm
1255X00071(TF)AC/DC Adapter.Input 100V~240V.output DC 19V.120W.6.32A.DC JACK w/Lock.FSP.FSP120-ABAN3/9NA1208548
170X000799(TF)POWER CORD.3P-125V 10A 180D.1.8M.USA.FANJET.YP12/YC-12
170X000800(TF)POWER CORD.3P-250V 10A 180D.1.8M.VDE.FAN-JET.YP-22/YC-12
170X000803(TF)Power cord.3P.125V/7A.1.8M.PSE YP12/YC12 Certificat
9651210000Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT5.2,2.4G/5G/6G,with 2 sets of cable & antenna(Intel AX210)
UPCR-CAMB-A10-0001MIPICSI Camera RVP Converter kit.for UP Squared Pro 7000/UP Squared i12.REV.A1.0
UPCR-HDMI-A10-0001HDMI IN carrier board for UPS i12, UPN 7000, UPX i12.REV.A1.0
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