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Versatile, Modular, & Essential

Exploring the Importance of Computer-on-Modules

A Computer-on-Module (COM) is a compact, integrated yet configurable computer that provides essential core components to custom carrier boards, chief among them being a CPU, memory, storage, I/O controllers for peripherals interfaces, and expansion slots.

COMs are designed to plug into a custom carrier board, which in turn provides connectors and power delivery tailored for embedded applications. The key feature of Computer-on-Modules are their modularity, which provides developers with an upgradable, customizable component with which they can reliably integrate with the same carrier board design, all while receiving benefits that come with the more advanced processors and technologies provided by the Computer-on-Module.

Application Potential

COMs are used in embedded systems where computing power is needed in compact spaces or customized environments. Applications include:

Industrial Automation

Healthcare and Medical Devices

Automotive

IoT and Edge Computing

Digital Signage

Transportation

AAEON offers a diverse range of Computer-on-Modules (COMs), including COM Express Type 6, Type 7, and Type 10 form factors, as well as SMARC, Qseven, and COM HPC compliant modules designed to provide high-performance computing solutions for industrial, edge AI, and IoT applications. AAEON’s Computer-on-Modules offer various configurations to suit the needs of carrier boards based on the level of performance, power consumption, and connectivity required.

AAEON’s modules are widely used in industrial, medical, and embedded applications, providing scalable options with varying CPU, GPU, and I/O capabilities to meet specific needs for edge computing, automation, and more. Modules are also designed for rugged, reliable performance, suitable for use in harsh environments.

COM Express Type 6

AAEON's COM Express Type 6 selection includes both Intel and AMD-powered modules available in both the standard 125mm x 95mm and 95mm x 95mm compact form factors. The range includes powerful processor options such as 13th Generation Intel® Core™ (Raptor Lake) and AMD Ryzen™ embedded processors, delivering high-performance computing for embedded systems. All COM Express Type 6 modules offer high-bandwidth I/Os and versatile expansion capabilities, making them ideal for applications across various industries.

COM Express Type 7

AAEON's COM Express Type 7 modules are built for demanding industrial and edge computing applications. Equipped with Intel® Xeon® D processors, AAEON’s COM Express Type 7 modules offer advanced interfaces such as 10G LAN, PCIe Gen 3, and multiple configurable USB. These modules excel in providing powerful computing capabilities in a compact 125mm x 95mm form factor, ideal for applications requiring high data throughput and network performance, such as edge AI, networking, and high-performance computing.

COM Express Type 10

AAEON's COM Express Type 10 modules perfectly balance high performance and power-efficiency in the extremely compact 84mm x 55mm form factor. The series is notable for its support of both efficiency-focused Intel® Processor N series CPUs and 13th Generation Intel® Core™ platforms (Raptor Lake-U). Designed with temperature ranges up to -40°C ~ 85°C, AAEON's COM Express Type 10 modules are well-suited where efficient power consumption and robust connectivity options for reliable operation are needed.

SMARC Modules

AAEON's SMARC module line-up offers a unique combination of both x86 and RISC computing architectures, including Intel Atom®, Intel® Processor N-series, and Intel Core™ i3-N305 on one side, and NXP i.MX 8M Plus – Quad-Core Arm® Cortex®-A53 Processor on the other end of the spectrum. These modules are SMARC 2.1 Compliant, built on the 82mm x 50mm form factor, and are designed to deliver scalable performance in embedded applications. Primary benefits include low power consumption, extensive I/O support, and integration with a variety of systems within edge computing, industrial automation, IoT, and other space-constrained applications.

Qseven Modules

AAEON's Qseven modules offer compact and efficient solutions based on the 70mm x 70mm Qseven standard, making them ideal for discreet deployment in embedded applications. Favoring efficient processing, AAEON’s Qseven modules are based on Intel Atom® x7000E and Intel® Processor N platforms, ranging from 6W to 15W. With rich I/O capabilities, they are designed for use in applications such as industrial automation, medical devices, and transportation. With such a small footprint, AAEON's Qseven modules are ideal for applications where space-efficiency is paramount, while still providing reliable performance at scale.

COM HPC

AAEON's COM HPC (Computer-on-Modules High-Performance Computing) range are an extremely powerful option when it comes to applications with high performance and data processing demands. AAEON’s COM HPC modules support 12th and 13th Gen Intel® Core™ processors, delivering up to up to 24 cores and 32 threads with adjustable clock speeds for efficient task execution with the inclusion of Intel® Turbo Boost Technology. This gives clients a high-performance platform guaranteed to handle demanding applications such as FPGA-based test equipment, AI-assisted roadside units, and edge servers.

Carrier Boards

AAEON's Carrier Boards provide highly versatile and reliable test environments for its comprehensive line of Computer-on-Modules. AAEON carrier boards are designed to provide users with multifaceted functionality, including versatile display interfaces and multipurpose I/Os, making them ideal for project testing on route to full implementation. With AAEON’s carrier board range, users can conveniently test and evaluate compatibility and project needs as they pertain to AAEON's Computer-on-Modules.

One of the key benefits of AAEON's carrier boards are their flexibility. Compatible with a wide range of Computer-on-Modules, they are built to make evaluating the suitability of different configurations without the need for additional hardware or equipment. This flexibility also makes it easy for users to switch between different products and configurations, reducing the need for multiple test environments.

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