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- 컴퓨터 온 모듈
- SMARC Modules
- uCOM-Q6490
uCOM-Q6490
SMARC CPU Module with Qualcomm QCS6490, up to Cortex-A78 x4 + Cortex-A55x4 processor
SYSTEM
Form Factor
SMARC 2.1 compliance
CPU
Qualcomm® Kryo™ CPU 670 built on Arm v8 Cortex technology
QCS6490 Gold+ x 1; Gold x 3; Silver x 4
Cortex-A78 x1 up to 2.7GHz, Cortex-A78 x3 up to 2.4 GHz, Cortex-A55 x4, up
to 1.9 GHz
QCS6490 Gold+ x 1; Gold x 3; Silver x 4
Cortex-A78 x1 up to 2.7GHz, Cortex-A78 x3 up to 2.4 GHz, Cortex-A55 x4, up
to 1.9 GHz
Chipset
—
Memory
Onboard LPDDR5, up to 8 GB
Storage
SDIO 3.0 x 1 (for SD Card)
UFS, 16/32/64 GB (optional)
UFS, 16/32/64 GB (optional)
BIOS
—
MTBF (hours)
TBD
Wake On LAN
—
Watchdog Timer
Yes
Real Time Clock
Yes
Boot Select
Carrier SD Card
Security
TPM 2.0 (optional)
DISPLAY
Graphics Controller
Qualcomm® Adreno™ 643L, Up to 812 MHz, OpenGL® ES 3.2, DirectX® FL 12,
OpenCL™ 2.0 FP, Vulkan® 1.1
OpenCL™ 2.0 FP, Vulkan® 1.1
Video Output
DP 1.4 x 1
MIPI-DSI 4-Lane x 1
MIPI-DSI 4-Lane x 1
I/O
Ethernet
Gigabit Ethernet x 2 (optional)
USB Port
USB 2.0 x 4 (OTG x 1)
Serial Port
UART x 2 (4-wire, 1.8V)
UART x 2 (2-wire, 1.8V, one for debug port)
UART x 2 (2-wire, 1.8V, one for debug port)
Audio
I2S x 2
PCIe
PCIe 2.0 x1
CANBus
—
MIPI-CSI
4 Lane x 1 + 2 Lane x 1
GPIO
14 bits (one for PWM)
Other Interface
SPI x 2
I2C x 5
I2C x 5
Power
Power Requirement
DC 5 V, AT/ATX
Power Consumption
TBD
Environmental And Mechanical
Dimensions
82mm x 50 mm
Weight
0.0625 lb (0.02kg)
Operating Temperature
-40°C ~ 85°C
Storage Temperature
-40°C ~ 80°C
Operating Humidity
0% ~ 95% relative humidity, non-condensing
Certification
CE/FCC Class A
OS support
Yocto 4.0
Support Protocol
—
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