UP SQUARED TWL
UP Squared TWL | Compact Fanless SBC with Intel® N-series SoC
SYSTEM
processor
Intel® Core™ 3 Processor N355
Intel® Processor N250
Intel® Processor N150
(formerly Twin Lake)
Intel® Processor N250
Intel® Processor N150
(formerly Twin Lake)
Graphics
Intel® UHD Graphics for 12th Gen Intel® Processors
Memory
Up to 16GB LPDDR5
Storage
Up to 128GB eMMC
I/O
HDMI 2.0b x 1
DP 1.2 x 1
eDP 1.3 x 1
Audio wafer (Line out + MIC in) x 1
RS-232/422/485 via wafer x 2
DP 1.2 x 1
eDP 1.3 x 1
Audio wafer (Line out + MIC in) x 1
RS-232/422/485 via wafer x 2
Camera
—
USB
USB 2.0 x 2 (from 10 pin wafer x 1)
USB 3.2 Gen 2 Type A x 3
USB 3.2 Gen 2 Type A x 3
Expansion
40 pin GPIO x 1
M.2 2230 E-Key x 1 (PCIe [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe [x2])
M.2 2230 E-Key x 1 (PCIe [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe [x2])
Display Interface
HDMI 2.0b x 1
DP 1.2 x 1
eDP 1.3 x 1
DP 1.2 x 1
eDP 1.3 x 1
Ethernet
Gb Ethernet (full speed) RJ-45 x 2
Security
Onboard TPM 2.0
RTC
Yes
OS support
Microsoft Windows 10/11
Ubuntu 22.04 LTS
Yocto 5.1
Ubuntu 22.04 LTS
Yocto 5.1
POWER REQUIREMENT
Power
12V DC-in
Power Supply Type
AT/ ATX (ATX as default)
Power Consumption (Typical)
15W~37W
MECHANICAL
Dimension
3.37" x 3.54" (85.6 mm × 90 mm)
Net Weight
0.41 lbs (0.19kg)
Gross Weight
0.66 lbs (0.3kg)
ENVIRONMENT
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C) / 0.5 airflow, WiTAS1 -4°F ~ 158°F (-20°C ~ 70°C) with active cooler
Operating Humidity
0% ~ 90% relative humidity, non-condensing
MTBF
1,224,238
Certification
CE/FCC Class A, RoHS Compliant, REACH
close
歡迎聯繫我們，我們很樂意為您提供專業的服務與建議
報價諮詢