UP TWLS – Ultra-Slim, Wi-Fi Ready IoT Board
Streamlined for Wireless Edge Applications
The UP TWLS is built for developers who need powerful, wireless-ready solutions in tight spaces. Featuring the same Twin Lake processor options (Intel® Core™ 3 Processor N355, Intel® Processor N250, or N150), the UP TWLS offers efficiency and flexibility in a compact 85mm x 56mm form factor.
With M.2 E-Key support for Wi-Fi modules, a 10-pin RS-232/422/485 wafer for industrial serial communication, and configurable wafers offering I2C, SPI, and 8-bit GPIO, the UP TWLS is made for wireless edge computing. Its design is ideal for IoT deployments such as smart sensors, data loggers, or compact automation controllers where slim design and flexible I/O are key.
Able to operate in temperatures from -20°C to 70°C, the UP TWLS provides dependable performance even in rugged environments—making it the perfect fit for edge AI, industrial IoT, and space-constrained embedded systems.
✦ 🔔 Free Edge AI Toolkit — streamline object detection, benchmarking, and AI model conversion to accelerate your AI projects on UP platforms. Try Edge AI Toolkit now >
